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    Corporate Governance

    • Board of Directors

    • Management Team

    Zheng Li

    Chief Executive Officer

    Mr. Zheng Li joined the company as Chief Executive Officer on September 9, 2019. He was appointed as a Director of the Board for JCET and certain subsidiaries of the Company on September 26, 2019. Mr. Zheng received his Master degree in Financial Economic Management from the University of Tokyo. He has over 26 years of experience working in IC companies in the United States, Japan, Europe and China. Prior to his current position, Mr. Zheng served as Global Senior Vice President of NXP, President of NXP Greater China, CEO of Renesas Greater China. He also served as President of NEC Greater China, Vice President of Huahong International, General Manager of Shanghai Hong Ri and other senior management positions.

    Luo Hongwei

    Executive Vice President

    Mr. Luo Hongwei has been appointed as Executive Vice President of JCET on April 21, 2016. He became a Board of Director of the company and its certain subsidiaries since May 17, 2019. Mr. Luo Hongwei has been deeply involved in the industry of semiconductor integrated circuit packaging and testing for more than 30 years. He has been leading purchasing, sales, manufacturing, operation and other departments of the company for a long time, and has accumulated rich and hands-on experience in Chinese semiconductor packaging and testing industry.

    Janet Chou

    Chief Financial Officer

    Ms. Janet Chou joined the company as Chief Financial Officer on October 15, 2019. Ms. Janet Chou holds a bachelor's degree in accounting from the University of Texas, San Antonio and an MBA from Santa Clara University, California. She is a certified public accountant of California. Prior to joining JCET Group, Ms. Janet Chou was Global Vice President of NXP Semiconductors, CFO of NXP Semiconductors Greater China and CFO of NXP Portable & Computing Business Unit. She also served as Finance Director of ON Semiconductor and California Micro Devices (acquired by ON Semiconductor).

    Choon Heung Lee

    Chief Technology Officer

    Dr. Lee Choon Heung joined the company as Chief Technology Officer on May 17, 2019. Prior to joining the company, Dr. Lee served as Chief Technology Officer and Executive Vice President for Worldwide Manufacturing Operations at Amkor Technology, and President of Amkor Korea. Dr. Lee holds a Masters of Solid State Physics and a Ph.D. in Theoretical Solid State Physics from Case Western Reserve University. He has written various research papers on various packaging technology related subjects and was granted 38 patents in Korea and 21 patents in the US.

    Mu Haoping

    Senior Vice President, Capital Operations

    Mr. Mu Haoping was appointed Senior Vice President for JCET Capital Operations on October 15, 2019. He holds an MBA degree from Xi'an Jiaotong University, and he is a Researcher-Level Senior Accountant. Mr. Mu served as Chief Financial Officer and Senior Vice President of JCET. Prior to that, he served as Director and Chairman of the board of directors of Zhongwei Guomai Communication (600640), Director, Secretary of party committee and Finance Director for China Satellite Communications. Prior to this, he held senior management positions at Rainbow Group and CWGC Finance.Communications. Prior to this, he held senior management positions on the financal posts of Rainbow Group and CWGC.

    Wu Hongkun

    Secretary of the Board

    Mr. Wu Hongkun joined the company as Secretary of the Board on May 17, 2019. He received his Master degree in Business Economics from Wilfrid Laurier University. Mr. Wu served as Assistant to Chairman and IR Assistant Director for SMIC. Prior to that, he served as a business manager for Spreadtrum. He has nearly 15 years of experience in the semiconductor field and has a deep understanding and rich experience in domestic and international capital market and investor relations management. He was awarded one of the Top Three Best Investor Relations Professionals in Asia semiconductor sector by the Institutional Investors in 2018 and 2019.

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